Technical advice on heat pipes and vapor chambers.
We support everything from product design for HP and VC to process design and manufacturing equipment development.
Heat pipes (HP) and vapor chambers (VC) are used as heat dissipation methods, particularly for electronic components and devices such as CPUs, GPUs, and power devices. In such fields, there is a tendency for increased integration density, and the heat generation density has greatly exceeded 100 W/cm². Therefore, the enhancement of heat dissipation devices is becoming increasingly necessary. Furthermore, it is believed that applications will advance not only in electronic and electrical devices but also in heat dissipation measures for lithium-ion batteries and methods for temperature uniformity in residential and agricultural sectors.
- Company：プロセスD&Tラボ 千葉
- Price：100,000 yen-500,000 yen
